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huh :shocked: :wtf:tuned said:Check out that hsf, copper heatpipes and all! Jeebus, they shouldn't overheat like previous gen PlayStations... they better not at least!
I'm kinda surprised Sony used thermal paste over thermal pads for the cpu's, much more complex I'd assume... or is that why there is paste on the mobo near the end? :lol: :nonod:
GreyKirby said:huh :shocked: :wtf:
I understood. The benefit of using paste over pads is that paste has fewer contact points, meaning more solid heat transfer. Paste also bonds over time creating an even better conformity. I dare anyone outside the computer or chemistry world to understand that.tuned said:Whoops, I forgot this was a console forum. My bad. What I said was: the cooler for the ps3 is more complex than I would have ever assumed. :thumbsup:
COLDshiver said:Yeah, it'd be more than enough to cook my breakfast :lol: